- Operating Temperature :
- Package / Case :
- Supplier Device Package :
- Voltage - Supply :
- Core Processor :
26 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Applications | Package / Case | Interface | Supplier Device Package | Voltage - Supply | Core Processor | Number of I/O | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
عرض . |
3,021
بقعة
|
Microchip Technology | PRODSTD IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
2,639
بقعة
|
Microchip Technology | PRODFF IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
3,174
بقعة
|
Microchip Technology | PRODSTD COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
3,162
بقعة
|
Microchip Technology | PRODFF COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
3,711
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | ||
|
|
|
عرض . |
3,290
بقعة
|
Microchip Technology | FF COM SPI TPM 4X4 32VQFN CEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
2,575
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | ||
|
|
|
عرض . |
614
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | ||
|
|
|
عرض . |
2,318
بقعة
|
Microchip Technology | PRODFF IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
3,092
بقعة
|
Microchip Technology | PRODSTD IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
2,570
بقعة
|
Microchip Technology | PRODFF COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
3,768
بقعة
|
Microchip Technology | PRODSTD COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
1,239
بقعة
|
Microchip Technology | FF COM SPI TPM 4X4 32VQFN CEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
3,021
بقعة
|
Microchip Technology | PRODSTD IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
2,639
بقعة
|
Microchip Technology | PRODFF IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
3,174
بقعة
|
Microchip Technology | PRODSTD COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
3,162
بقعة
|
Microchip Technology | PRODFF COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
3,711
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | ||
|
|
|
عرض . |
3,290
بقعة
|
Microchip Technology | FF COM SPI TPM 4X4 32VQFN CEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
2,575
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | ||
|
|
|
عرض . |
614
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | ||
|
|
|
عرض . |
2,318
بقعة
|
Microchip Technology | PRODFF IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
3,092
بقعة
|
Microchip Technology | PRODSTD IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
2,570
بقعة
|
Microchip Technology | PRODFF COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
3,768
بقعة
|
Microchip Technology | PRODSTD COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||
|
|
|
عرض . |
1,239
بقعة
|
Microchip Technology | FF COM SPI TPM 4X4 32VQFN CEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 |
1 / 1 صفحة .
