- Series :
- Part Status :
- Operating Temperature :
- Supplier Device Package :
- Voltage - Supply :
- Core Processor :
- RAM Size :
- Program Memory Type :
115 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Applications | Package / Case | Interface | Supplier Device Package | Voltage - Supply | Core Processor | Number of I/O | RAM Size | Program Memory Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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|
عرض . |
1,291
بقعة
|
Microchip Technology | IC CRYPTO TPM 40QFN | - | Discontinued at Digi-Key | Digi-Reel® | 0°C ~ 70°C | - | Trusted Platform Module (TPM) | - | SPI | - | 3.3V | AVR | 4 | - | - | ||
|
|
|
عرض . |
1,367
بقعة
|
Microchip Technology | IC CRYPTO TPM 40QFN | - | Discontinued at Digi-Key | Cut Tape (CT) | 0°C ~ 70°C | - | Trusted Platform Module (TPM) | - | SPI | - | 3.3V | AVR | 4 | - | - | ||
|
|
|
عرض . |
1,805
بقعة
|
Microchip Technology | IC CRYPTO TPM 40QFN | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | - | Trusted Platform Module (TPM) | - | SPI | - | 3.3V | AVR | 4 | - | - | ||
|
|
عرض . |
1,828
بقعة
|
Microchip Technology | PL250A-AKU-Y SAMG55J19A-MU LQFP | - | Active | - | -40°C ~ 85°C | - | Power Line Communications | - | SPI | - | 3 V ~ 3.6 V | External | - | - | - | ||
|
|
|
عرض . |
3,361
بقعة
|
Microchip Technology | PL230A-AKU-Y SAMG55J19A-MU LQFP | - | Active | - | -40°C ~ 85°C | - | Power Line Communications | - | SPI | - | 3 V ~ 3.6 V | External | - | - | - | ||
|
|
|
عرض . |
3,895
بقعة
|
Microchip Technology | PL250A-AKU-R SAMG55J19A-MUT LQFP | - | Active | - | -40°C ~ 85°C | - | Power Line Communications | - | SPI | - | 3 V ~ 3.6 V | External | - | - | - | ||
|
|
|
عرض . |
3,839
بقعة
|
Microchip Technology | PL230A-AKU-R SAMG55J19A-MUT LQFP | - | Active | - | -40°C ~ 85°C | - | Power Line Communications | - | SPI | - | 3 V ~ 3.6 V | External | - | - | - | ||
|
|
عرض . |
807
بقعة
|
Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Active | Tape & Reel (TR) | -20°C ~ 85°C | Surface Mount | Embedded Security Trusted Computing | 32-VFQFN Exposed Pad | SPI | PG-VQFN-32-13 | 1.65 V ~ 3.6 V | 16-Bit | 1 | - | - | |||
|
|
|
عرض . |
1,321
بقعة
|
Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Active | Tape & Reel (TR) | -20°C ~ 85°C | Surface Mount | Embedded Security Trusted Computing | 32-VFQFN Exposed Pad | SPI | PG-VQFN-32-13 | 1.65 V ~ 3.6 V | 16-Bit | 1 | - | - | |||
|
|
عرض . |
3,021
بقعة
|
Microchip Technology | PRODSTD IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||
|
|
|
عرض . |
2,639
بقعة
|
Microchip Technology | PRODFF IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||
|
|
|
عرض . |
3,174
بقعة
|
Microchip Technology | PRODSTD COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||
|
|
|
عرض . |
3,162
بقعة
|
Microchip Technology | PRODFF COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||
|
|
عرض . |
1,415
بقعة
|
Echelon Corporation | COMM PROCESSOR W/FOUR NEURON COR | IzoT™ | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | Smart Transceiver | 48-VFQFN Exposed Pad | SPI | 48-QFN (7x7) | 3 V ~ 3.6 V | Neuron | 12 | 64K x 8 | External Program Memory | ||
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|
|
عرض . |
1,330
بقعة
|
Echelon Corporation | COMM PROCESSOR W/FOUR NEURON COR | IzoT™ | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | Smart Transceiver | 48-VFQFN Exposed Pad | SPI | 48-QFN (7x7) | 3 V ~ 3.6 V | Neuron | 12 | 64K x 8 | External Program Memory | ||
|
|
|
عرض . |
2,057
بقعة
|
Echelon Corporation | COMM PROCESSOR W/FOUR NEURON COR | IzoT™ | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Smart Transceiver | 48-VFQFN Exposed Pad | SPI | 48-QFN (7x7) | 3 V ~ 3.6 V | Neuron | 12 | 64K x 8 | External Program Memory | ||
|
|
|
عرض . |
1,516
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | - | - | ||
|
|
|
عرض . |
3,711
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | - | - | ||
|
|
عرض . |
2,128
بقعة
|
Microchip Technology | IC CRYPTO TPM 28TSSOP | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | SPI | 28-TSSOP | 3.3V | AVR | 4 | - | - | ||
|
|
|
عرض . |
2,013
بقعة
|
Microchip Technology | IC CRYPTO TPM 28TSSOP | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | SPI | 28-TSSOP | 3.3V | AVR | 4 | - | - | ||
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|
|
عرض . |
2,752
بقعة
|
Microchip Technology | IC CRYPTO TPM 28TSSOP | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | SPI | 28-TSSOP | 3.3V | AVR | 4 | - | - | ||
|
|
|
عرض . |
3,290
بقعة
|
Microchip Technology | FF COM SPI TPM 4X4 32VQFN CEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||
|
|
|
عرض . |
3,936
بقعة
|
Echelon Corporation | TRANC CHIP W/INTEGRATED NEURON C | IzoT™ | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | Smart Transceiver | 48-VFQFN Exposed Pad | SPI | 48-QFN (7x7) | 3 V ~ 3.6 V | Neuron | 12 | 64K x 8 | External Program Memory | ||
|
|
|
عرض . |
2,724
بقعة
|
Echelon Corporation | TRANC CHIP W/INTEGRATED NEURON C | IzoT™ | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | Smart Transceiver | 48-VFQFN Exposed Pad | SPI | 48-QFN (7x7) | 3 V ~ 3.6 V | Neuron | 12 | 64K x 8 | External Program Memory | ||
|
|
|
عرض . |
3,064
بقعة
|
Echelon Corporation | TRANC CHIP W/INTEGRATED NEURON C | IzoT™ | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Smart Transceiver | 48-VFQFN Exposed Pad | SPI | 48-QFN (7x7) | 3 V ~ 3.6 V | Neuron | 12 | 64K x 8 | External Program Memory | ||
|
|
عرض . |
1,441
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | - | - | ||
|
|
|
عرض . |
3,347
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Discontinued at Digi-Key | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | - | - | ||
|
|
|
عرض . |
3,070
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | - | - | ||
|
|
|
عرض . |
3,230
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Discontinued at Digi-Key | Digi-Reel® | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | - | - | ||
|
|
|
عرض . |
1,111
بقعة
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Discontinued at Digi-Key | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | - | - |
1 / 4 صفحة .
