إنشاء منصة تجارية موثوق بها من المصنعين والموردين في جميع أنحاء العالم .
Series :
Contact Finish - Mating :
Number of Positions or Pins (Grid) :
27434 المنتجات
صور نموذج الأسعار الكمية جرد صانع وصف Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
Default Photo
عرض .
RFQ
Samtec Inc. CONN SOCKET PLCC 32POS TIN Obsolete                                
Default Photo
عرض .
RFQ
Samtec Inc. CONN SOCKET PLCC 32POS TIN Obsolete                                
Default Photo
عرض .
RFQ
Samtec Inc. CONN SOCKET PLCC 32POS TIN PLCC Obsolete   -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin   Tin 32 (2 x 7, 2 x 9) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
Default Photo
وحدة
$188.6880
عرض .
RFQ
3M BGA 1MM 25 25MM 23 MATRIX 168PIN   Active                                
Default Photo
وحدة
$154.1100
عرض .
RFQ
3M BGA SOCKET 1MM 676 POS 26X26   Active           BGA                    
Default Photo
وحدة
$91.6360
عرض .
RFQ
3M 10X10 GRID ZIP SOCKET   Active   -55°C ~ 150°C Through Hole Solder Closed Frame   Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 100 (10 x 10) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
وحدة
$57.8180
عرض .
RFQ
3M BGA 1.00MM 9X9 8X8 64 PIN   Active                                
Default Photo
وحدة
$34.4000
عرض .
RFQ
TE Connectivity AMP Connectors CONN SOCKET LGA 2011POS GOLD   Active     Surface Mount Solder Open Frame LGA Thermoplastic   Gold 30.0µin (0.76µm) Gold 2011 (47 x 58) Copper Alloy   30.0µin (0.76µm) Copper Alloy
Default Photo
وحدة
$16.1600
عرض .
RFQ
TE Connectivity AMP Connectors DUAL LGA,257 POS, DMD SOCKET DMD Active   -25°C ~ 100°C Surface Mount Solder Board Guide, Open Frame LGA Thermoplastic 0.039" (1.00mm) Gold 3.00µin (0.076µm)   257 (20 x 30) Copper Alloy      
Default Photo
وحدة
$14.2600
عرض .
RFQ
TE Connectivity AMP Connectors CONN SOCKET LGA 1151POS GOLD   Active     Surface Mount Solder Closed Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) Gold 1151 Copper Alloy 0.036" (0.91mm) 15.0µin (0.38µm) Copper Alloy
Default Photo
وحدة
$6.4400
عرض .
RFQ
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Threaded Solder   SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
وحدة
$6.1600
عرض .
RFQ
Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
وحدة
$5.2400
عرض .
RFQ
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
وحدة
$4.3900
عرض .
RFQ
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
وحدة
$2.4500
عرض .
RFQ
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 18POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
وحدة
$2.4300
عرض .
RFQ
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
وحدة
$2.0900
عرض .
RFQ
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 14POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
وحدة
$1.6600
عرض .
RFQ
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Flash Beryllium Copper
Default Photo
وحدة
$1.5400
عرض .
RFQ
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active   -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
D01-9933246
وحدة
$7.3000
عرض .
RFQ
100
بقعة
Harwin Inc. CONN SOCKET SIP 32POS TIN D01-993 Active   -55°C ~ 125°C Through Hole Solder Cup   SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin   Tin 32 (1 x 32) Brass 0.100" (2.54mm)   Brass
Default Photo
عرض .
RFQ
450
بقعة
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
Default Photo
وحدة
$2.7500
عرض .
RFQ
450
بقعة
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
Default Photo
وحدة
$1.8981
عرض .
RFQ
450
بقعة
Samtec Inc. CONN IC DIP SOCKET 8POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
Default Photo
عرض .
RFQ
700
بقعة
Samtec Inc. CONN IC DIP SOCKET 16POS TIN Active                                
Default Photo
وحدة
$2.1600
عرض .
RFQ
700
بقعة
Samtec Inc. CONN IC DIP SOCKET 16POS TIN Active                                
Default Photo
وحدة
$1.2723
عرض .
RFQ
700
بقعة
Samtec Inc. CONN IC DIP SOCKET 16POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 16 (2 x 8) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
Default Photo
عرض .
RFQ
450
بقعة
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
Default Photo
وحدة
$1.4100
عرض .
RFQ
450
بقعة
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
Default Photo
وحدة
$0.9520
عرض .
RFQ
450
بقعة
Samtec Inc. CONN IC DIP SOCKET 8POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
Default Photo
عرض .
RFQ
275
بقعة
Samtec Inc. CONN IC DIP SOCKET 32POS TIN Active