- Package / Case :
- Supplier Device Package :
10 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Mounting Type | Applications | Package / Case | Type | Supplier Device Package | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
عرض . |
3,541
بقعة
|
Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 484-BGA | TDM (Time Division Multiplexing) | 484-TEBGA (23x23) | ||
|
|
|
عرض . |
1,939
بقعة
|
Maxim Integrated | IC TDM/PACKET TRANSPORT | - | Not For New Designs | Tray | Surface Mount | Data Transport | 484-BGA | TDM (Time Division Multiplexing) | 484-TEBGA (23x23) | ||
|
|
عرض . |
1,925
بقعة
|
Maxim Integrated | IC TRANSPORT TDM 484BGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 484-BGA | TDM (Time Division Multiplexing) | 484-TEBGA (23x23) | ||
|
|
|
عرض . |
3,862
بقعة
|
Maxim Integrated | IC TDM OVER PACKET 484BGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 484-BGA | TDM (Time Division Multiplexing) | 484-TEBGA (23x23) | ||
|
|
عرض . |
3,003
بقعة
|
Maxim Integrated | IC TRANSPORT TDM SGL 256-CSBGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 256-BGA, CSBGA | TDM (Time Division Multiplexing) | 256-CSBGA (17x17) | ||
|
|
|
عرض . |
3,302
بقعة
|
Maxim Integrated | IC TDM OVER PACKET 484BGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 484-BGA | TDM (Time Division Multiplexing) | 484-TEBGA (23x23) | ||
|
|
|
عرض . |
3,113
بقعة
|
Maxim Integrated | IC TDM OVER PACKET 484BGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 484-BGA | TDM (Time Division Multiplexing) | 484-TEBGA (23x23) | ||
|
|
|
عرض . |
1,819
بقعة
|
Maxim Integrated | IC TDM OVER PACKET 484HSBGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 484-BGA Exposed Pad | TDM (Time Division Multiplexing) | 484-HSBGA (23x23) | ||
|
|
عرض . |
2,904
بقعة
|
Maxim Integrated | IC TRANSPORT TDM 256CSBGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 256-BGA, CSBGA | TDM (Time Division Multiplexing) | 256-CSBGA (17x17) | ||
|
|
عرض . |
1,149
بقعة
|
Maxim Integrated | IC TRANSPORT TDM DUAL 256-CSBGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 256-BGA, CSBGA | TDM (Time Division Multiplexing) | 256-CSBGA (17x17) |
1 / 1 صفحة .
