- Supplier Device Package :
12 المنتجات
صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Part Status | Input Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package | Voltage - Supply | Channel Type | Driven Configuration | Number of Drivers | Gate Type | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | Rise / Fall Time (Typ) | |
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عرض . |
2,487
بقعة
|
Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||
|
عرض . |
2,487
بقعة
|
Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||
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عرض . | Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | ||||
|
عرض . |
1,200
بقعة
|
Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||
|
عرض . |
1,200
بقعة
|
Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||
|
عرض . |
1,200
بقعة
|
Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||
|
عرض . |
3,300
بقعة
|
Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||
|
عرض . |
3,300
بقعة
|
Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||
|
عرض . |
3,300
بقعة
|
Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||
|
عرض . |
3,300
بقعة
|
Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||
|
عرض . |
3,300
بقعة
|
Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns | |||
|
عرض . |
3,300
بقعة
|
Microchip Technology | 3.0A MATCHED, HIGH -SPEED, LOW-S | Active | Inverting, Non-Inverting | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | 4.5 V ~ 18 V | Independent | High-Side | 2 | IGBT | 0.8V, 2V | 3A, 3A | 12ns, 12ns |
1 / 1 صفحة .