- Part Status :
- Operating Temperature :
- Memory Size :
20 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package | Voltage - Supply | Memory Type | Memory Size | Access Time | Memory Format | Write Cycle Time - Word, Page | Memory Interface | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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عرض . |
2,669
بقعة
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Microchip Technology | IC EEPROM 4MBIT 250NS 32FLATPACK | - | Obsolete | Tube | -40°C ~ 85°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 250ns | EEPROM | 10ms | Parallel | ||
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عرض . |
3,927
بقعة
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Microchip Technology | IC EEPROM 4MBIT 250NS 32FLATPACK | - | Obsolete | Tube | 0°C ~ 70°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 250ns | EEPROM | 10ms | Parallel | ||
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عرض . |
1,682
بقعة
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Microchip Technology | IC EEPROM 4MBIT 200NS 32FP | - | Obsolete | Tube | -40°C ~ 85°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 200ns | EEPROM | 10ms | Parallel | ||
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عرض . |
2,609
بقعة
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Microchip Technology | IC EEPROM 4MBIT 200NS 32FLATPACK | - | Obsolete | Tube | 0°C ~ 70°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 200ns | EEPROM | 10ms | Parallel | ||
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عرض . |
3,926
بقعة
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Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | ||
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عرض . |
3,087
بقعة
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Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | ||
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عرض . |
2,130
بقعة
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Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | ||
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عرض . |
3,263
بقعة
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Microchip Technology | IC EEPROM 1MBIT 150NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 150ns | EEPROM | 10ms | Parallel | ||
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عرض . |
2,933
بقعة
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Microchip Technology | IC EEPROM 1MBIT 250NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 250ns | EEPROM | 10ms | Parallel | ||
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عرض . |
3,612
بقعة
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Microchip Technology | IC EEPROM 1MBIT 200NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 200ns | EEPROM | 10ms | Parallel | ||
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عرض . |
2,669
بقعة
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Microchip Technology | IC EEPROM 4MBIT 250NS 32FLATPACK | - | Obsolete | Tube | -40°C ~ 85°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 250ns | EEPROM | 10ms | Parallel | ||
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عرض . |
3,927
بقعة
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Microchip Technology | IC EEPROM 4MBIT 250NS 32FLATPACK | - | Obsolete | Tube | 0°C ~ 70°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 250ns | EEPROM | 10ms | Parallel | ||
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عرض . |
1,682
بقعة
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Microchip Technology | IC EEPROM 4MBIT 200NS 32FP | - | Obsolete | Tube | -40°C ~ 85°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 200ns | EEPROM | 10ms | Parallel | ||
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عرض . |
2,609
بقعة
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Microchip Technology | IC EEPROM 4MBIT 200NS 32FLATPACK | - | Obsolete | Tube | 0°C ~ 70°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 200ns | EEPROM | 10ms | Parallel | ||
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عرض . |
3,926
بقعة
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Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | ||
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عرض . |
3,087
بقعة
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Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | ||
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عرض . |
2,130
بقعة
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Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | ||
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عرض . |
3,263
بقعة
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Microchip Technology | IC EEPROM 1MBIT 150NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 150ns | EEPROM | 10ms | Parallel | ||
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عرض . |
2,933
بقعة
|
Microchip Technology | IC EEPROM 1MBIT 250NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 250ns | EEPROM | 10ms | Parallel | ||
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عرض . |
3,612
بقعة
|
Microchip Technology | IC EEPROM 1MBIT 200NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 200ns | EEPROM | 10ms | Parallel |
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