2 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Package / Case | Interface | Supplier Device Package | Number of Circuits | Voltage - Supply | Function | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
عرض . |
1,334
بقعة
|
Maxim Integrated | IC TDM OVER PACKET 676-BGA | - | Active | Tray | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) | ||
|
|
|
عرض . |
1,334
بقعة
|
Maxim Integrated | IC TDM OVER PACKET 676-BGA | - | Active | Tray | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) |
1 / 1 صفحة .
