- Packaging :
6 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Features | Applications | Package / Case | Number of Channels | Supplier Device Package | -3db Bandwidth | Multiplexer/Demultiplexer Circuit | On-State Resistance (Max) | Voltage - Supply, Single (V+) | |
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عرض . |
1,068
بقعة
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ON Semiconductor | IC ANALOG SWITCH 20UMLP | - | Active | Digi-Reel® | -40°C ~ 85°C (TA) | Break-Before-Make | Telecommunications | 20-UFQFN Exposed Pad | 1 | 20-UMLP (3x3) | 210MHz | 2:2 | 3.5 Ohm | 1.65 V ~ 4.3 V | ||
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عرض . |
1,813
بقعة
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ON Semiconductor | IC ANALOG SWITCH 20UMLP | - | Active | Cut Tape (CT) | -40°C ~ 85°C (TA) | Break-Before-Make | Telecommunications | 20-UFQFN Exposed Pad | 1 | 20-UMLP (3x3) | 210MHz | 2:2 | 3.5 Ohm | 1.65 V ~ 4.3 V | ||
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عرض . |
2,574
بقعة
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ON Semiconductor | IC ANALOG SWITCH 20UMLP | - | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | Break-Before-Make | Telecommunications | 20-UFQFN Exposed Pad | 1 | 20-UMLP (3x3) | 210MHz | 2:2 | 3.5 Ohm | 1.65 V ~ 4.3 V | ||
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عرض . |
1,068
بقعة
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ON Semiconductor | IC ANALOG SWITCH 20UMLP | - | Active | Digi-Reel® | -40°C ~ 85°C (TA) | Break-Before-Make | Telecommunications | 20-UFQFN Exposed Pad | 1 | 20-UMLP (3x3) | 210MHz | 2:2 | 3.5 Ohm | 1.65 V ~ 4.3 V | ||
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عرض . |
1,813
بقعة
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ON Semiconductor | IC ANALOG SWITCH 20UMLP | - | Active | Cut Tape (CT) | -40°C ~ 85°C (TA) | Break-Before-Make | Telecommunications | 20-UFQFN Exposed Pad | 1 | 20-UMLP (3x3) | 210MHz | 2:2 | 3.5 Ohm | 1.65 V ~ 4.3 V | ||
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عرض . |
2,574
بقعة
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ON Semiconductor | IC ANALOG SWITCH 20UMLP | - | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | Break-Before-Make | Telecommunications | 20-UFQFN Exposed Pad | 1 | 20-UMLP (3x3) | 210MHz | 2:2 | 3.5 Ohm | 1.65 V ~ 4.3 V |
1 / 1 صفحة .
