- Part Status :
- Operating Temperature :
8 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Type | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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عرض . |
2,136
بقعة
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NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Obsolete | Tray | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||
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عرض . |
1,176
بقعة
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NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Obsolete | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||
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عرض . |
3,833
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||
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عرض . |
1,376
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Not For New Designs | Tray | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||
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|
|
عرض . |
2,136
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Obsolete | Tray | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||
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|
|
عرض . |
1,176
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Obsolete | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||
|
|
|
عرض . |
3,833
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External | ||
|
|
|
عرض . |
1,376
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Not For New Designs | Tray | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA, WDT | Coldfire V2 | 140MHz | 1.08 V ~ 1.32 V | - | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG | ROMless | A/D 6x12b | External |
1 / 1 صفحة .
