- Part Status :
- Packaging :
- Operating Temperature :
- Core Processor :
- Voltage - Supply (Vcc/Vdd) :
- Core Size :
- Connectivity :
-
- CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI (36)
- CAN, EBI/EMI, Ethernet, FlexRAY, I²C, LIN, SPI, PSI, UART/USART (6)
- CAN, Ethernet, FlexRay, LIN, SPI, UART/USART (65)
- CAN, Ethernet, FlexRay, I²C, LIN, SPI (101)
- CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG (15)
- EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI (20)
- اختيار مرشح :
243 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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عرض . |
2,580
بقعة
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 516BGA | MPC57xx | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
3,802
بقعة
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 416BGA | MPC57xx | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
2,175
بقعة
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 416BGA | MPC57xx | Obsolete | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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|
عرض . |
3,096
بقعة
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 516BGA | MPC57xx | Obsolete | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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|
عرض . |
2,020
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU QUAD POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 512-FBGA | 512-TEPBGA (25x25) | DMA, LVD, POR, Zipwire | e200z7 | 300MHz | 3 V ~ 5.5 V | - | 404K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexRAY, I²C, LIN, SPI, PSI, UART/USART | 8.64MB (8M x 8) | Flash | - | A/D 12b SAR, 16b Sigma-Delta | Internal | ||
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عرض . |
2,459
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU QUAD POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 300MHz | 3 V ~ 5.5 V | - | 404K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexRAY, I²C, LIN, SPI, PSI, UART/USART | 8.64MB (8M x 8) | Flash | - | A/D 12b SAR, 16b Sigma-Delta | Internal | ||
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عرض . |
1,724
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
2,808
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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|
عرض . |
3,518
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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|
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عرض . |
3,246
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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|
|
عرض . |
1,731
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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|
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عرض . |
3,203
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
1,500
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
3,807
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
1,572
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
3,739
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
2,078
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
2,601
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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|
عرض . |
3,085
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
3,427
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
1,835
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
1,411
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
3,930
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
664
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
3,374
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
701
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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|
عرض . |
1,084
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
3,258
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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|
عرض . |
3,455
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||
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عرض . |
908
بقعة
|
NXP USA Inc. | NXP 32-BIT MCU DUAL CORE POWER | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal |
1 / 9 صفحة .
