- Series :
- Packaging :
- Package / Case :
- Supplier Device Package :
- Core Processor :
- Speed :
- RAM Size :
- Core Size :
- Connectivity :
-
- CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG (2)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB (1)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG (4)
- CAN, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART (2)
- CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG (1)
- CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG (1)
11 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
عرض . |
1,756
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 282K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | A/D 16x10b, 6x12b, D/A 1x10b | Internal | ||
|
|
|
عرض . |
3,731
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | A/D 8x10b, D/A 1x10b | Internal | ||
|
|
|
عرض . | NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 282K x 8 | 32-Bit Dual-Core | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | ROMless | A/D 16x10b, 6x12b, D/A 1x10b | Internal | |||||
|
|
|
عرض . |
260
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 264K x 8 | 32-Bit Dual-Core | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | ROMless | A/D 4x10b; D/A 1x10b | Internal | ||||
|
|
|
عرض . |
1,756
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 282K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | A/D 16x10b, 6x12b, D/A 1x10b | Internal | ||
|
|
|
عرض . |
3,731
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | A/D 8x10b, D/A 1x10b | Internal | ||
|
|
|
عرض . |
1,091
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 264K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | A/D 4x10b; D/A 1x10b | Internal | ||
|
|
عرض . |
3,788
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 180TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 136K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART | - | ROMless | A/D 4x10b; D/A 1x10b | Internal | ||
|
|
|
عرض . |
2,268
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | - | ROMless | A/D 4x10b; D/A 1x10b | Internal | ||
|
|
|
عرض . |
1,357
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | A/D 8x10b, D/A 1x10b | Internal | ||
|
|
|
عرض . |
2,323
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 136K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART | - | ROMless | A/D 4x10b; D/A 1x10b | Internal |
1 / 1 صفحة .
