- Part Status :
- Operating Temperature :
- Package / Case :
- Supplier Device Package :
5 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
عرض . |
2,586
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||
.jpg)
|
|
عرض . |
1,578
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516TEPBGA | MPC5121e | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||
|
|
|
عرض . |
2,586
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||
|
|
|
عرض . |
1,578
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516TEPBGA | MPC5121e | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||
|
|
|
عرض . |
1,521
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External |
1 / 1 صفحة .
