- Part Status :
- Package / Case :
- Supplier Device Package :
12 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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عرض . |
2,200
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Obsolete | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | ||
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عرض . |
2,960
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Obsolete | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | ||
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عرض . |
1,932
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Obsolete | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | ||
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|
عرض . |
3,438
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 196MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | EBI/EMI, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | ||
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عرض . |
2,101
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | ||
|
|
|
عرض . |
2,200
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Obsolete | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | ||
|
|
|
عرض . |
2,960
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Obsolete | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | ||
|
|
|
عرض . |
1,932
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Obsolete | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | ||
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|
|
عرض . |
3,438
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 196MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | EBI/EMI, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | ||
|
|
|
عرض . |
2,101
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | ||
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|
|
عرض . |
1,034
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | ||
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|
|
عرض . |
1,634
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External |
1 / 1 صفحة .
