- Package / Case :
- Supplier Device Package :
- Data Converters :
6 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
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عرض . |
1,629
بقعة
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NXP USA Inc. | IC MCU 32BIT ROMLESS 144LQFP | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 83 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | - | ROMless | A/D 8x10b; D/A 1x10b | Internal | ||
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عرض . |
1,629
بقعة
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NXP USA Inc. | IC MCU 32BIT ROMLESS 144LQFP | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 83 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | - | ROMless | A/D 8x10b; D/A 1x10b | Internal | ||
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عرض . |
2,268
بقعة
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | - | ROMless | A/D 4x10b; D/A 1x10b | Internal | ||
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عرض . |
2,796
بقعة
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256LBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-LBGA (17x17) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 164 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | - | ROMless | A/D 8x10b; D/A 1x10b | Internal | ||
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عرض . |
628
بقعة
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NXP USA Inc. | IC MCU 32BIT ROMLESS 180TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 118 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | - | ROMless | A/D 8x10b; D/A 1x10b | Internal | ||
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عرض . |
2,971
بقعة
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256LBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-LBGA (17x17) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 164 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | - | ROMless | A/D 8x10b; D/A 1x10b | Internal |
1 / 1 صفحة .
