- Part Status :
- Packaging :
- RAM Size :
- Program Memory Type :
8 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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عرض . |
1,192
بقعة
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 144BGA | LPC2200 | Obsolete | Tray | -40°C ~ 85°C (TA) | 144-TFBGA | 144-TFBGA (12x12) | POR, PWM, WDT | ARM7® | 60MHz | 1.65 V ~ 3.6 V | 112 | 16K x 8 | 16/32-Bit | CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | 256KB (256K x 8) | Flash | - | A/D 8x10b | Internal | ||
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عرض . |
2,276
بقعة
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 144BGA | LPC2200 | Obsolete | Tray | -40°C ~ 85°C (TA) | 144-TFBGA | 144-TFBGA (12x12) | POR, PWM, WDT | ARM7® | 60MHz | 1.65 V ~ 3.6 V | 112 | 16K x 8 | 16/32-Bit | CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | 256KB (256K x 8) | Flash | - | A/D 8x10b | Internal | ||
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عرض . |
3,457
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 144TFBGA | LPC2200 | Active | Tray | -40°C ~ 85°C (TA) | 144-TFBGA | 144-TFBGA (12x12) | POR, PWM, WDT | ARM7® | 75MHz | 1.65 V ~ 3.6 V | 76 | 64K x 8 | 16/32-Bit | EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | - | ROMless | - | A/D 8x10b | Internal | ||
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|
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عرض . |
1,192
بقعة
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 144BGA | LPC2200 | Obsolete | Tray | -40°C ~ 85°C (TA) | 144-TFBGA | 144-TFBGA (12x12) | POR, PWM, WDT | ARM7® | 60MHz | 1.65 V ~ 3.6 V | 112 | 16K x 8 | 16/32-Bit | CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | 256KB (256K x 8) | Flash | - | A/D 8x10b | Internal | ||
|
|
|
عرض . |
2,276
بقعة
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 144BGA | LPC2200 | Obsolete | Tray | -40°C ~ 85°C (TA) | 144-TFBGA | 144-TFBGA (12x12) | POR, PWM, WDT | ARM7® | 60MHz | 1.65 V ~ 3.6 V | 112 | 16K x 8 | 16/32-Bit | CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | 256KB (256K x 8) | Flash | - | A/D 8x10b | Internal | ||
|
|
|
عرض . |
3,457
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 144TFBGA | LPC2200 | Active | Tray | -40°C ~ 85°C (TA) | 144-TFBGA | 144-TFBGA (12x12) | POR, PWM, WDT | ARM7® | 75MHz | 1.65 V ~ 3.6 V | 76 | 64K x 8 | 16/32-Bit | EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | - | ROMless | - | A/D 8x10b | Internal | ||
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عرض . |
981
بقعة
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 144TFBGA | LPC2200 | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 144-TFBGA | 144-TFBGA (12x12) | POR, PWM, WDT | ARM7® | 75MHz | 1.65 V ~ 3.6 V | 76 | 64K x 8 | 16/32-Bit | EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | - | ROMless | - | A/D 8x10b | Internal | ||
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|
|
عرض . |
2,183
بقعة
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 144BGA | LPC2200 | Active | Tray | -40°C ~ 85°C (TA) | 144-TFBGA | 144-TFBGA (12x12) | POR, PWM, WDT | ARM7® | 60MHz | 1.65 V ~ 3.6 V | 112 | 16K x 8 | 16/32-Bit | CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | 256KB (256K x 8) | Flash | - | A/D 8x10b | Internal |
1 / 1 صفحة .
