- Package / Case :
- Supplier Device Package :
3 المنتجات
| صور | نموذج | الأسعار | الكمية | جرد | صانع | وصف | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
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عرض . |
2,381
بقعة
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NXP USA Inc. | IC MCU 32BIT ROMLESS 208LQFP | LPC2400 | Active | Tray | -40°C ~ 85°C (TA) | 208-LQFP | 208-LQFP (28x28) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM7® | 72MHz | 3 V ~ 3.6 V | 160 | 82K x 8 | 16/32-Bit | EBI/EMI, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | - | ROMless | A/D 8x10b; D/A 1x10b | Internal | ||
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عرض . |
2,381
بقعة
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NXP USA Inc. | IC MCU 32BIT ROMLESS 208LQFP | LPC2400 | Active | Tray | -40°C ~ 85°C (TA) | 208-LQFP | 208-LQFP (28x28) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM7® | 72MHz | 3 V ~ 3.6 V | 160 | 82K x 8 | 16/32-Bit | EBI/EMI, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | - | ROMless | A/D 8x10b; D/A 1x10b | Internal | ||
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عرض . |
3,749
بقعة
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NXP USA Inc. | IC MCU 32BIT ROMLESS 208TFBGA | LPC2400 | Active | Tray | -40°C ~ 85°C (TA) | 208-TFBGA | 208-TFBGA (15x15) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM7® | 72MHz | 3 V ~ 3.6 V | 160 | 82K x 8 | 16/32-Bit | EBI/EMI, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | - | ROMless | A/D 8x10b; D/A 1x10b | Internal |
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